发明名称 Method of manufacturing an integrated circuit carrier.
摘要 An integrated circuit carrier arrangement includes a printed circuit board (PCB), a receiving plate to which an integrated circuit can be mounted, and a carrier fast with the PCB. The carrier has a plurality of resilient interconnection arms and a plurality of electrical connection islands. A number of the interconnection arms interconnect adjacent electrical connection islands, and a number of the interconnection arms interconnect an electrical connection island and the receiving plate, so that a plurality of electrical connection islands surrounds the receiving plate.
申请公布号 ZA200303174(B) 申请公布日期 2003.11.06
申请号 ZA20030003174 申请日期 2003.04.24
申请人 SILVERBROOK RESEARCH (PTY) LIMITED 发明人 KIA SILVERBROOK
分类号 H01L23/12;H01L21/48;H01L23/13;H01L23/14;H01L23/498;H05K1/02;H05K3/34 主分类号 H01L23/12
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