SUBSTRATE TREATMENT APPARATUS

摘要

A substrate treatment apparatus can prevent positional shift of a treatment liquid supply nozzle, enabling smooth convey of the treatment liquid supply nozzle and increase the positional accuracy of the treatment liquid supply nozzle, thereby improving the treatment accuracy and yield. The apparatus includes a spin chuck (50) for rotatably holding a wafer (W), a plurality of treatment liquid supply nozzles (60) for supplying treatment liquid onto the surface of the wafer (W), wait holding means (70) for holding the nozzles (60) at waiting position, and a nozzle convey arm (80) for detachably holding one of the nozzles (60) held by the wait holding means (70) and conveying it above the wafer (W). Each of the nozzles (60) is arranged on a straight line (L) connecting the rotation center (C) of the spin chuck (50) and a nozzle holding opening (71) provided at an appropriate interval in the wait holding means (70). Flexible supply tubes (61) connecting the nozzles (60) with a treatment liquid supply source are arranged along the elongations of the straight lines (L).