| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized low temperature test apparatus which eliminates the need for a thermostatic bath, prevents frosts from occurring at a measuring IC socket and improves quality of an operation test. SOLUTION: The test apparatus for semiconductor devices is provided with the socket 4 which is connected to the semiconductor device to be tested mounted thereon; a testing tray 3 which contains the semiconductor device to be tested and a first electronic cooling element being arranged at a position, where semiconductor device to be tested is mounted and performing an endothermic reaction on one surface and an exothermic reaction on the other surface; and a contact block 1 which has a second electronic cooling element being in contact with an upper portion of the semiconductor device to be tested, in such a state that the semiconductor device to be tested is mounted on the socket. The semiconductor device to be tested is contained in the testing tray, the bottom side of the semiconductor device to be tested is precooled by the first electronic cooling element, and then the testing tray is mounted on the socket. The test is carried out while cooling the bottom side and the upper side of the semiconductor device to be tested mounted on the socket by using the first electronic element and the second electronic element respectively, and after completing the test, the semiconductor device to be tested is heated by using the first electronic element of the testing tray. COPYRIGHT: (C)2004,JPO
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