发明名称 Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung
摘要 <p>The heat sink has a heat sink body (1) made of a good heat conductive material and a fan assembly (2) installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is as the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer. <IMAGE></p>
申请公布号 DE69332840(T2) 申请公布日期 2003.11.06
申请号 DE1993632840T 申请日期 1993.05.28
申请人 FUJITSU LTD., KAWASAKI;PFU LTD., ISHIKAWA 发明人 KATSUI, TADASHI;NAKATA, KATSUHIKO;KOGA, TAKESHI;MATSUMURA, TADANOBU;TANAKA, YOSHIMI;SUGIMOTO, YASUAKI;HORINISHI, TAKAYUKI;KITAHARA, TAKASHI
分类号 H01L23/36;G06F1/20;H01L23/40;H01L23/467;H05K7/20;(IPC1-7):H01L23/467 主分类号 H01L23/36
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