| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method capable of effectively inspecting a plurality of measurement and characteristics to be inspected, and to provide an inspection device. SOLUTION: The bump inspection device is provided with a 1st and a 2nd frame memories (image buffer 1, 2) for storing images taken by a CCD. An image inputting circuit inputs taken image data to the 1st frame memory or the 2nd frame memory alternately. While one memory is taking the image data, another memory is subjected to processing taken image data for measurement and inspection. COPYRIGHT: (C)2004,JPO
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