| 摘要 |
A modular electronic system includes a plurality of stacked electronic units. The stacked units have a first cavity therethrough along one edge thereof, and a second cavity therethrough along an opposite edge thereof. Each of the units has a spacing joining the two cavities. A first mounting plate has an orifice therethrough for communicating with the first cavity, and a second mounting plate has an orifice therethrough for communicating with the second cavity. Means are provided for clamping the fist mounting plate, the stacked units, and the second mounting plate together, so that cooling fluid can be passed from an exterior source through the first mounting plate orifice, through the first cavity, through in parallel all of the spacings, through the second cavity, and exiting through the second mounting plate orifice. |
