| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein if a normal metallic material has a stress gradient in the range of an X-ray penetration depth of several ten microns, accurate measurement of residual stress is impossible to make it difficult to accurately evaluate a residual stress in a surface layer of a structure subjected to surface hardening such as shot peening and carburizing or to machining, or a surface residual stress in a micro device such as an electronic part. SOLUTION: An X-ray residual stress measuring method, which comprises a means for depositing a metal film of a known X-ray diffraction angle over a surface of a measured object, and a means for measuring a residual stress by irradiating the measured object surface with X rays, executes the X-ray residual stress measurement as holding the metal film deposit over the measured object surface. COPYRIGHT: (C)2004,JPO
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