The invention relates to a sealing structure (6) suitable for a polymer-based electronic device (1), characterized in that the sealing structure (6) comprises a first layer (7) of a first dielectric material formed on said device (1) and a second layer (8) of a second dielectric material formed on the first layer (7).
申请公布号
WO03050894(A3)
申请公布日期
2003.11.06
申请号
WO2002IB05132
申请日期
2002.12.03
申请人
KONINKLIJKE PHILIPS ELECTRONICS N.V.;LIFKA, HERBERT;HASKAL, ELIAV, I.
