发明名称 |
Method and apparatus for improving adhesion between layers in integrated devices |
摘要 |
In an integrated device, a via is formed in a substrate layer and a barrier layer is formed on the substrate layer in the via. A seed layer is formed on the barrier layer in the via. The seed layer includes a first material and a second material. The first material provides an ability for the second material to maintain an adherence to the barrier layer.
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申请公布号 |
US2003207562(A1) |
申请公布日期 |
2003.11.06 |
申请号 |
US20020138393 |
申请日期 |
2002.05.03 |
申请人 |
FAUST RICHARD A.;JIANG QING-TANG;LU JIONG-PING |
发明人 |
FAUST RICHARD A.;JIANG QING-TANG;LU JIONG-PING |
分类号 |
H01L21/3205;H01L21/768;H01L23/532;(IPC1-7):H01L21/476;H01L21/44 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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