| 摘要 |
<p>A polishing method capable of energizing a polished object to the end of polishing with a stable current density distribution and allowing to use the other equipment such as conventional plating equipment and washing equipment and to perform a manufacturing process flow, comprising the steps of disposing, opposite to each other, a substrate (1) having a metal film (2) formed thereon and an opposed electrode (3) in electrolyte at a specified interval, and energizing the metal film (2) by an anode (4) in the state of non-contact with the metal film (2) through the electrolyte for electrolytically polishing the metal film (2) while performing a wiping by sliding a pad on the metal film.</p> |
