EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE OBTAINED USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor exhibiting excellent moisture resistance reliability not to mention high flame retardancy without using a conventional red phosphor-containing flame-retardant, not to mention a halogen-containing flame-retardant or an antimony compound. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises the following components (A) through (E): (A) an epoxy resin; (B) a phenolic resin; (C) a cure accelerator; (D) an inorganic filler; and (E) a melamine salt compound. COPYRIGHT: (C)2004,JPO