发明名称 |
Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal |
摘要 |
A method of manufacturing a semiconductor device is provided. The method comprises a wire-forming step of forming a wiring on a substrate having an electrode pad so as to connect the electrode pad to a mounting terminal. The wire-forming step includes the steps of: applying a metal foil to the substrate by providing an adhesive therebetween; patterning the metal foil into a predetermined pattern so as to form the wiring; and connecting the wiring to the electrode pad electrically.
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申请公布号 |
US2003207574(A1) |
申请公布日期 |
2003.11.06 |
申请号 |
US20030443837 |
申请日期 |
2003.05.23 |
申请人 |
FUJITSU LIMITED |
发明人 |
AIBA YOSHITAKA;SATO MITSUTAKA |
分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L23/12;H01L23/31;H01L23/48;H01L23/485;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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