| 摘要 |
A method is provided in which repeater cells are automatically inserted within a sub-micron design before the physical design of the die has been started. The method automatically inserts a predetermined number of repeater cells within the interconnect lines that couple functional blocks on a semiconductor die. In a preferred embodiment, the repeater cell insertion is carried out during the logical design stage by adding a series of commands within a commercially available synthesis tool. A placement tool optimizes the physical placement of the repeater cells within the die.
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