发明名称 |
Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package |
摘要 |
An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
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申请公布号 |
US2003207494(A1) |
申请公布日期 |
2003.11.06 |
申请号 |
US20030442298 |
申请日期 |
2003.05.21 |
申请人 |
FUJIKURA LTD.;TEXAS INSTRUMENTS JAPAN LIMITED |
发明人 |
SUZUKI TAKANAO;INABA MASATOSHI;OMINATO TADANORI;KAIZU MASAHIRO;KUROSAKA AKIHITO;INABA MASATOSHI;SADAKATA NOBUYUKI;MASUMOTO MUTSUMI;MASUMOTO KENJI |
分类号 |
H01L21/56;H01L23/31;H01L23/485;H01L23/525;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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