发明名称 |
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof |
摘要 |
Devices having one or more of the following: an input/output (I/O) interconnect system, an optical I/O interconnect, an electrical I/O interconnect, a radio frequency I/O interconnect, are disclosed. A representative I/O interconnect system includes a first substrate and a second substrate. The first substrate includes a compliant pillar vertically extending from the first substrate. The compliant pillar is constructed a first material. The second substrate includes a compliant socket adapted to receive the compliant pillar. The compliant socket is constructed of a second material.
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申请公布号 |
US2003206680(A1) |
申请公布日期 |
2003.11.06 |
申请号 |
US20030430670 |
申请日期 |
2003.05.05 |
申请人 |
GEORGIA TECH RESEARCH CORPORATION |
发明人 |
BAKIR MUHANNAD S.;MARTIN KEVIN P.;MEINDL JAMES D. |
分类号 |
G01R1/04;G02B6/12;G02B6/42;G02B6/43;H01L23/498;H05K3/32;(IPC1-7):G02B6/12 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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