| 摘要 |
An adhesive film for protection of semiconductor surfaces including a substrate film on the surface of which an adhesive layer is formed, where the substrate film fulfils specific stiffness, bending strength, elastic modulus and water absorption conditions is new. An adhesive film for protection of semiconductor surfaces including a substrate film on the surface of which an adhesive layer is formed, where the substrate film fulfils conditions (A) and at least one of conditions (B) and (C) below: (A) high stiffness, and a film bending strength of 0.08-1.50 N at 50degreesC; (B) the film bending strength at 90degreesC is one third or less than the value at 50degreesC; a high elastic modulus on expansion by water absorption, where the size ratio after 4 hours absorption in water at 23degreesC and 90% relative air humidity is 0.05 to 0.5%. An Independent claim is included for a process for treating the rear surface of a semiconductor wafer including the steps: fixing of an adhesive film to protect the wafer surface from the back surface of another (sic) wafer via the adhesive layer, decrease in thickness of the back surface until the thickness is decreased to 150 micron or less, and finally removal of the adhesive film by heating to a temperature of 50-90degreesC, where the adhesive film is as described above.
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