发明名称 METHOD FOR AIR-TIGHTLY SEALING HOLLOW PART FOR VENTILATING HOLE WITH SOLDER
摘要 PROBLEM TO BE SOLVED: To provide a soldering treatment and solder-joining with which a hollow part having thin thickness, wide area and basically no void, can air- tightly be sealed, in a method for air-tightly sealing the hollow part for ventilating hole with solder. SOLUTION: The method for fitting parts, comprises a step for forming an assembly (200, 205, 300, 305) containing first parts (210, 310), second parts (220, 320) and joining materials (230, 315) between the first parts and the second parts, a step for forming the hollow parts (240, 340) having the ventilating holes (250, 255, 350) in the first and the second parts and a step for activating the joining material (230) by heating the assembly (200) so that bubble in the joining material is exhausted to the surroundings of the assembly from the joining material (230) through the hollow part (240) and the ventilating hole (250) during heating treatment. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003311400(A) 申请公布日期 2003.11.05
申请号 JP20030107373 申请日期 2003.04.11
申请人 AGILENT TECHNOL INC 发明人 HUMPSTON GILES;ICHIMURA YOSHIKATSU;MAR NANCY M;MILLER DANIEL J;NYSTROM MICHAEL J;TROTT GARY R
分类号 B23K1/20;B23K1/00;B23K1/008;B23K1/14;B23K1/19;B23K31/02;(IPC1-7):B23K1/20 主分类号 B23K1/20
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