| 摘要 |
PROBLEM TO BE SOLVED: To enable electrically-connected joint for an electrode of a semiconductor element for an electrode of a circuit substrate in a very short time and also the acquisition of high reliability for the joint. SOLUTION: In this manufacturing method, electrodes 8 of semiconductor element 7 are contacted with electrodes 18 of a circuit substrate 12 with the use of conductive adhesive 17 provided therebetween, so that the element 7 is mounted on the substrate 12, the element 7 and substrate 12 in this condition are positioned within closed spaces 21, 23 and 36. Next, the internal pressure of the closed space 21 is reduced to have solvent in the adhesive 17 evaporated and to have the adhesive 17 set. An electrically connected state between the electrode elements 8 and substrate electrodes 18 is fixed with the use of the set adhesive 17, and the element 7 is mounted on the substrate 12, thus obtaining a semiconductor device 20. |
