| 摘要 |
<P>PROBLEM TO BE SOLVED: To downsize a high-frequency induction thermal plasma device. <P>SOLUTION: A gas ring 3 for supplying plasma gas into a pipe is attached to the top of a cylindrical member 2 made of an insulation material. An induction coil 4 is wound around the cylindrical member 2. The upper part and the lower part of the cylindrical members 2 are supported by an upper flange 5a' and a lower flange 5b' respectively. The upper flange 5a' and the lower flange 5b' are fixed to a support 6' made of silicon nitride. A probe 11 is installed in the center of the gas ring 3. An opening is longitudinally perforated in the central part of the probe 11, and a powder material is supplied together with a carrier gas through the opening. The plasma gas is supplied into the cylindrical member 2 from the outside of the gas ring 3. High-frequency electric power is supplied from a high-frequency power source to a high-frequency coil 4. <P>COPYRIGHT: (C)2004,JPO |
