发明名称 |
METHOD AND APPARATUS FOR FORMING FILM PATTERN, CONDUCTIVE FILM WIRING, ELECTROOPTICAL APPARATUS, ELECTRONIC DEVICE, NON-CONTACT TYPE CARD MEDIUM, PIEZOELECTRIC ELEMENT, AND INK-JET RECORDING HEAD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a film pattern which accomplishes the thickening of a patterning film obtained by an ink-jet method and makes the thickness of the patterning film uniform by improving the shapes of edges. <P>SOLUTION: Lap coating discharge is repeated in the first discharge process, and in a stage [a dry film S<SB>5</SB>in Fig. 6 (a)] in which a film thickness comes to a certain extent close to a desired film thickness, in order to improve the shapes of the edges by the final minute adjustment of the film thickness, the second dispersion of a low concentration is discharged in the second discharge process [Fig. 6 (b)-(e)]. By discharging the second dispersion, a dry film pattern formed on a substrate can be minutely adjusted to have the desired film thickness, the film thickness is made uniform, and the shapes of the edges are improved äFig. 6 (e)}. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003311196(A) |
申请公布日期 |
2003.11.05 |
申请号 |
JP20020118287 |
申请日期 |
2002.04.19 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HASHIMOTO TAKASHI;ISHIDA MASAYA;SAKAI MARI |
分类号 |
B41J2/045;B05C5/00;B05C9/06;B05D1/26;B05D1/34;B05D5/12;B41J2/055;B41J2/135;B41J2/14;B41J2/145;B41J2/16;G02F1/1335;G06K19/077;G09F9/00;H01B1/20;H01J9/02;H01L21/288;H01L21/3205;H01L21/768;H01L41/09;H01L41/22;H01L41/317;H01L51/50;H05B33/10;H05B33/14;H05K3/10 |
主分类号 |
B41J2/045 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|