| 摘要 |
1,251,454. Integrated circuit. RCA CORPORATION. 9 June, 1969 [17 June, 1968], No. 29057/69. Heading H1K. In an integrated circuit block at least one of the circuit element configurations is used not as a circuit element but as a support for a bonding pad. A portion of a monolithic silicon block comprising a set of transistor and resistor configurations connectible to form a variety of logic circuits forms the basis of the circuit. Internal connections of these circuits are provided by patterning a layer of aluminium deposited on a first oxide passivating layer. Bonding pads via which inter-circuit connections may be made are formed from a further layer of aluminium insulated from the first by a second layer of oxide. They overlie unused circuit elements and contact all zones of such elements via apertures in the insulation, as shown in Fig. 8, and may have connecting leads thermocompression bonded to them. A conductor 26 constituted by part of the upper aluminium layer may cross over a conductive track 23 constituted by a part of the first aluminium layer which extends between a pair Q x , Q Y of unused transistors and is joined at its ends to other parts 24, 25 of the upper aluminium layer, as shown in Fig. 10. Connections of the elements into various logic circuits is described. |
