发明名称 |
VARNISH FOR LAMINATE OR PREPREG, LAMINATE OR PREPREG OBTAINED WITH THIS VARNISH, AND PRINTED CIRCUIT BOARD MADE WITH THIS LAMINATE OR PREPREG |
摘要 |
Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70 DEG C to less than 140 DEG C so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg. |
申请公布号 |
EP1359175(A1) |
申请公布日期 |
2003.11.05 |
申请号 |
EP20010270570 |
申请日期 |
2001.12.12 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
HIRAI, YASUYUKI;ABE, NORIHIRO;TAKEDA, YOSHIYUKI |
分类号 |
B32B15/08;C08G59/40;C08G59/68;H05K1/03;(IPC1-7):C08G59/40;C08G59/50;C08J5/24;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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