发明名称 METHOD AND APPARATUS FOR MOLDING THIN PLASTIC MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To devise a molding method and a molding apparatus for suppressing the lowering of the temperature of a resin by supplying heat to the resin fluidized in a cavity to keep the necessary flowability of the resin without raising the temperature of a mold, for the purpose of avoiding the loss of the fluidity of the molten resin by the lowering of the temperature of the resin simultaneously with the contact of the resin fluidized in the cavity with the surface of the mold at the time of injection molding of a thin-walled molded product having a large surface area. SOLUTION: In the method for molding the thin plastic molded product, the molten resin is charged in the cavity formed by a fixed mold and a movable mold and, after the resin in the cavity is cooled and solidified, the movable mold is moved to open the mold, the molded product is taken out. A high-frequency electric field is applied to the molten resin flowing in a space ranging from the gate of the cavity to the end of the cavity to control the temperature of the resin by high-frequency induction heating to prevent the lowering of fluidity of the resin. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003311799(A) 申请公布日期 2003.11.05
申请号 JP20020118749 申请日期 2002.04.22
申请人 RICOH CO LTD 发明人 SUDO KATSUNORI
分类号 B29C45/73;B29C45/78;(IPC1-7):B29C45/73 主分类号 B29C45/73
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