High speed flip-chip dispensing

摘要

The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is the top side of the chip as loaded on the tape, and is normally the side of the chip that engages the head of the pick tool. For flip-chip assembly it is necessary to invert the chip for solder bonding to an interconnect substrate. In the technique of the invention, the chip carrier tape is inverted and inserted into the dispensing machine upside down. The IC chips are then ejected through the back of the tape instead of being lifted from the from of the tape. In this way the pick tool head engages the back side of the solder bumped chip and the chip is in the proper orientation for flip-chip placement and bonding on the interconnect substrate.