发明名称 Heat insulating housings, thermostatic housings and cryostats accommodating electronic parts
摘要 <p>A heat insulation chamber according to the present invention is a heat insulation chamber which is made of heat insulating material and forms an inner chamber for accommodating an electronic part.This heat insulation chamber achieves coupling between the electronic part accommodated in the inner chamber formed within a cabinet and the outside of the cabinet by a radio transmission path or a coupling path by static coupling or inductive coupling.A thermostatic chamber and a cryostat according to the present invention comprise the aforementioned heat insulation chamber, a heat exchanger mounted in the heat insulation chamber, and a thermoregulator which maintains the temperature of the inner chamber accommodating the electronic part at an operating temperature of the electronic part through the heat exchanger.Equipments which adopt any heat insulation chambers, thermostatic chambers, or cryostats can be maintained so to have desired characteristics in a stable condition and accurately with their physical size kept from increasing greatly.</p>
申请公布号 GB2343090(B) 申请公布日期 2003.11.05
申请号 GB19990019687 申请日期 1999.08.19
申请人 * FUJITSU LIMITED 发明人 KAZUHIKO * KOBAYASHI;KAZUNORI * YAMANAKA;AKIHIKO * AKASEGAWA;YOSHIHARU * TOZAWA;FUMIHIKO * KOBAYASHI;ICHIRO * ABENO
分类号 H04B5/00;F16L59/16;F17C3/08;H01L39/04;H01P5/02;(IPC1-7):F17C13/08 主分类号 H04B5/00
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