发明名称 MANUFACTURING METHOD OF MECHANISM DEVICE, MECHANISM DEVICE, AND MICRO-REED SWITCH AND ELECTROSTATIC DRIVE TYPE SWITCH
摘要 PROBLEM TO BE SOLVED: To provide a mechanism device having a cantilever beam structure smaller in size by using micromachine technology which can be applied to a switch or a sensor and contribute to make them also smaller in size. SOLUTION: The manufacturing method of the mechanism device has a sacrifice layer forming process for forming a sacrifice layer on a substrate 1, and a cantilever beam structure forming process for forming a structure layer 31 comprising a conductive material on the substrate 1 including the sacrifice layer, and removing the sacrifice layer by etching and forming a cantilever beam structure 31 on a substrate 2. Each of the sacrifice layer and the structure layer 31 is formed by a photolithography process for forming an opening pattern by patterning a photoresist film, an electroplating process for laminating a predetermined layer on the opening pattern by electroplating, and an etching process for removing the photoresist film. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003311698(A) 申请公布日期 2003.11.05
申请号 JP20020123087 申请日期 2002.04.24
申请人 OKI SENSOR DEVICE CORP;TOKAI UNIV 发明人 ARIMA NAOKUNI;KOBAYASHI TATSURO;SATO YOICHI
分类号 B81C1/00;B81B3/00;H01H59/00;(IPC1-7):B81C1/00 主分类号 B81C1/00
代理机构 代理人
主权项
地址