发明名称 |
MANUFACTURING METHOD OF MECHANISM DEVICE, MECHANISM DEVICE, AND MICRO-REED SWITCH AND ELECTROSTATIC DRIVE TYPE SWITCH |
摘要 |
PROBLEM TO BE SOLVED: To provide a mechanism device having a cantilever beam structure smaller in size by using micromachine technology which can be applied to a switch or a sensor and contribute to make them also smaller in size. SOLUTION: The manufacturing method of the mechanism device has a sacrifice layer forming process for forming a sacrifice layer on a substrate 1, and a cantilever beam structure forming process for forming a structure layer 31 comprising a conductive material on the substrate 1 including the sacrifice layer, and removing the sacrifice layer by etching and forming a cantilever beam structure 31 on a substrate 2. Each of the sacrifice layer and the structure layer 31 is formed by a photolithography process for forming an opening pattern by patterning a photoresist film, an electroplating process for laminating a predetermined layer on the opening pattern by electroplating, and an etching process for removing the photoresist film. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003311698(A) |
申请公布日期 |
2003.11.05 |
申请号 |
JP20020123087 |
申请日期 |
2002.04.24 |
申请人 |
OKI SENSOR DEVICE CORP;TOKAI UNIV |
发明人 |
ARIMA NAOKUNI;KOBAYASHI TATSURO;SATO YOICHI |
分类号 |
B81C1/00;B81B3/00;H01H59/00;(IPC1-7):B81C1/00 |
主分类号 |
B81C1/00 |
代理机构 |
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