发明名称 Methodology to introduce metal and via openings
摘要 A method including forming a photoimageable material on a substrate; developing the photoimageable material over an opening area, the photoimageable material over a first portion of the opening area developed to a first extent and the photoimageable material over a second portion of the opening area developed to a different second extent; removing developed photoimageable material from the opening area; and forming an opening in the substrate in the opening area.
申请公布号 US6641982(B2) 申请公布日期 2003.11.04
申请号 US20010878058 申请日期 2001.06.07
申请人 INTEL CORPORATION 发明人 JAIN AJAY
分类号 G03F1/14;H01L21/311;H01L21/768;H01L23/532;(IPC1-7):G03F7/00 主分类号 G03F1/14
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