| 摘要 |
An implantable medical device (IMD) is disclosed that is formed on a substrate composed of liquid crystal polymer (LCP). In one embodiment, the IMD can be an interconnection module for interconnecting an electrode array to an equipment module. The interconnecting module includes conductors disposed on the LCP substrate and coupled to the electrode array, and wherein the conductors are encapsulated using a silicone or LCP encapsulant. In another embodiment, the IMD is an electrode array and interconnect module disposed on an integral LCP substrate. An equipment module can be coupled to the interconnect module. Alternatively, a hybrid electronic circuit can be coupled to the interconnect module for signal processing and conditioning signals received from the electrode array or for providing stimulus signals to the electrode array. In this embodiment, all of the conductors and at least a portion of the electrodes in the electrode array are encapsulated using a silicone or LCP encapsulant. In another embodiment, the IMD is an electrode array, an interconnecting module, and a hybrid circuit that are disposed on an LCP substrate. The interconnecting module is used to provide signal paths to and from the electrodes in the electrode array to the hybrid circuit. In this embodiment, all of the conductors, the hybrid electronic circuit and at least a portion of the electrodes in the electrode array are encapsulated using a silicone or LCP encapsulant.
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