发明名称 Solid-state energy storage module employing integrated interconnect board
摘要 The present invention is directed to an improved electrochemical energy storage device. The electrochemical energy storage device includes a number of solid-state, thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect board. The interconnect board is typically disposed within a sealed housing which also houses the electrochemical cells, and includes a first contact and a second contact respectively coupled to first and second power terminals of the energy storage device. The interconnect board advantageously provides for selective series or parallel connectivity with the electrochemical cells, irrespective of electrochemical cell position within the housing. Fuses and various electrical and electromechanical devices, such as bypass, equalization, and communication devices for example, may also be mounted to the interconnect board and selectively connected to the electrochemical cells.
申请公布号 US6641942(B1) 申请公布日期 2003.11.04
申请号 US20000665810 申请日期 2000.09.20
申请人 3M INNOVATIVE PROPERTIES COMPANY;HYDRO-QUEBEC CORPORATION 发明人 ROUILLARD JEAN;COMTE CHRISTOPHE;DAIGLE DOMINIK;HAGEN RONALD A.;KNUDSON ORLIN B.;MORIN ANDRE;RANGER MICHEL;ROSS GUY;ROUILLARD ROGER;ST-GERMAIN PHILIPPE;SUDANO ANTHONY;TURGEON THOMAS A.
分类号 H01M2/10;H01M2/20;H01M2/22;H01M2/34;H01M6/18;H01M6/50;H01M10/04;H01M10/48;H01M10/50;H05K1/11;H05K1/18;(IPC1-7):H01M2/20 主分类号 H01M2/10
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