发明名称 |
Semiconductor device with protective layer |
摘要 |
A semiconductor device includes a substrate and a first insulating film provided above the semiconductor substrate. A first interconnecting layer is provided on the first insulating film. A second insulating film is provided above the first interconnecting layer and the first insulating layer. A first protective film is provided above the second insulating film and composed substantially of metal material. A second protective film is composed substantially of a passivity of the metal material and provided on a surface of the first protective film.
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申请公布号 |
US6642622(B2) |
申请公布日期 |
2003.11.04 |
申请号 |
US20030369517 |
申请日期 |
2003.02.21 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
USUI TAKAMASA;ITO SACHIYO |
分类号 |
H01L23/433;H01L23/532;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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