发明名称 Semiconductor device with protective layer
摘要 A semiconductor device includes a substrate and a first insulating film provided above the semiconductor substrate. A first interconnecting layer is provided on the first insulating film. A second insulating film is provided above the first interconnecting layer and the first insulating layer. A first protective film is provided above the second insulating film and composed substantially of metal material. A second protective film is composed substantially of a passivity of the metal material and provided on a surface of the first protective film.
申请公布号 US6642622(B2) 申请公布日期 2003.11.04
申请号 US20030369517 申请日期 2003.02.21
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 USUI TAKAMASA;ITO SACHIYO
分类号 H01L23/433;H01L23/532;(IPC1-7):H01L23/48 主分类号 H01L23/433
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