发明名称 Method of manufacturing compound semiconductor device
摘要 There is provided a compound semiconductor device having a capacitor, to prevent a leakage current flowing between an upper electrode and a lower electrode of the capacitor via an insulating protective film. The compound semiconductor device comprises a first electrode of a capacitor formed on a compound semiconductor substrate via a first insulating film, a dielectric film of the capacitor formed on the first electrode, a second electrode of a capacitor formed on the dielectric film, a second insulating film for covering an upper surface and side surfaces of the second electrode, and an insulating protective film for covering the second insulating film, the dielectric film, the first electrode and the first insulating film, and having a hydrogen containing rate which is larger than the second insulating film.
申请公布号 US6642099(B2) 申请公布日期 2003.11.04
申请号 US20020139238 申请日期 2002.05.07
申请人 FUJITSU QUANTUM DEVICES LIMITED 发明人 ARIMOCHI KENJI;IGARASHI TSUTOM;NUNOKAWA MITSUJI
分类号 H01L21/02;H01L21/285;H01L21/335;H01L21/8252;H01L27/06;(IPC1-7):H01L21/824;H01L21/20 主分类号 H01L21/02
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