发明名称 Method for manufacturing semiconductor laser device
摘要 On a laminate containing a p-InGaAsP layer, one of layers including a diffraction grating layer, an SiO2 insulating film pattern that has first rectangular openings, each opening having a long side orthogonal with the direction of the optical wave guide, periodically arranged at intervals in the direction of the optical wave guide is formed. An SiN insulating film pattern having a second opening with a strip shape having a width narrower than the long side of the first opening, extending in the direction of the optical wave guide, is formed on the SiO2 insulating film pattern. The laminate containing the p-InGaAsP layer is dry-etched using the SiO2 insulating film pattern and the SiN insulating film pattern as masks, and methane and a hydrogen plasma as the etching media.
申请公布号 US6642075(B2) 申请公布日期 2003.11.04
申请号 US20020202023 申请日期 2002.07.25
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 TAKIGUCHI TOHRU
分类号 H01L21/3065;H01S5/12;H01S5/20;H01S5/22;(IPC1-7):H01L21/00 主分类号 H01L21/3065
代理机构 代理人
主权项
地址