| 发明名称 |
DUAL-SIDED HEAT REMOVAL SYSTEM |
| 摘要 |
The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate. |
| 申请公布号 |
AU2003228399(A1) |
申请公布日期 |
2003.11.03 |
| 申请号 |
AU20030228399 |
申请日期 |
2003.03.27 |
| 申请人 |
INTEL CORPORATION |
发明人 |
GILROY VANDENTOP;CHIA-PIN CHIU;RAJENDRAN NAIR;YIAN-LIANG LI |
| 分类号 |
H05K1/02;H05K1/18;(IPC1-7):H01L23/367 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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