发明名称 BOND SUPPLY DEVICE
摘要 PURPOSE: A bond supply device is provided to prevent bond from being leaked to the outside because a leaked bond is recovered to the inside of a tank and make corrective maintenance easier as a motor for driving a screw can be installed outside the tank. CONSTITUTION: The device comprises: a tank(1); and a heater(2), wherein the device comprises: a pump housing(10) curved in an L shape and having a vertical hole(11) formed inside a vertical end for mounting a screw(13); an outlet hole(12) communicating the upper end of the vertical hole(11); a screw(13) pumping bond in the tank(1) as rotated; a motor(14) with its rotary shaft(15) connected to the upper part of the screw(13); and an auxiliary heater(16) heating the bond passing through the outlet hole(12) to keep a hot melt temperature.
申请公布号 KR20030084201(A) 申请公布日期 2003.11.01
申请号 KR20020022771 申请日期 2002.04.25
申请人 CHO, HEE WANG 发明人 CHO, HEE WANG
分类号 A43D25/18;(IPC1-7):A43D25/18 主分类号 A43D25/18
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