DEPOSITION RING OF SPUTTERING APPARATUS

摘要

PURPOSE: A deposition ring of a sputtering apparatus is provided to prevent an electrostatic chuck from being damaged by preventing a wafer sticking problem from arising caused by an increased deposition material. CONSTITUTION: An inner end part(21) is installed on the stepped outer part of the electrostatic chuck(10), separated from the outer diameter surface of an upper part of the electrostatic chuck by a fine space such that the outer diameter of the upper part is relatively small. A guide groove(22) of a predetermined width is downward inserted into a position right under the outer end part of the wafer installed in the electrostatic chuck. A sliding preventing protrusion(23) makes the outer end part of the guide groove protrude more upward than the height of the wafer installed in the electrostatic chuck.