TEST HEAD OF SEMICONDUCTOR ELECTRICAL DIE SORTING TEST APPARATUS

摘要

PURPOSE: A test head of a semiconductor electrical die sorting(EDS) test apparatus is provided to reduce loss time caused by replacing a device board by simply assembling and disassembling the device board on a stiffener fixed to a mounting unit while using a fix ring including a bearing. CONSTITUTION: A plurality of bearing guiding grooves(106) are formed on the mounting unit(100), separated from each other by a predetermined interval. A slant hole(108) having an downward surface is formed under the bearing guiding groove. A lower coupling groove(110) is formed in the bottom of the mounting unit so that the mounting unit includes a rotation case(102) capable of rotating at a predetermined angle. A bearing insertion groove(140) corresponding to the bearing guiding groove is formed in the outside of the stiffener(120). An upper coupling groove(138) corresponding to the lower coupling groove is formed so that the stiffener is fixed to the inside of the rotation case of the mounting unit by a fixing screw(144). The device board(150) is positioned on the stiffener. The fix ring(160) is inserted into the bearing insertion groove and the bearing guiding groove of the stiffener by interposing the device board. A bearing(166) that is coupled and fixed to the slant hole by the rotation of the rotation case is installed in the bottom surface of the fix ring.