发明名称 METHOD AND APPARATUS FOR PARTIALLY PLATING SURFACE OR CUT SECTION OF PURE METAL OR METAL ALLOY
摘要 PURPOSE: A method and an apparatus for performing partial plating in such a way that a different metal or metal alloy is electroplated or electroless plated on the surface or cut section of a pure metal or metal alloy to be plated are provided. CONSTITUTION: The apparatus comprises a cylinder(1) for introducing plating solution; a plating solution agitator(2) mounted on the upper part of the cylinder along with motor to uniformly disperse the plating solution; a projected jig(3) formed at the lower part of the cylinder to expose the plating solution so as to perform partial plating on the metal alloy or pure metal; a pure metal or metal alloy supporting support(4) repeatedly connected to or separated from the jig as the pure metal or metal alloy supporting support is being moved up and down; a pure metal or metal alloy(5) fixed to the supporting support; a plating solution(6) introduced to the cylinder; and a DC power supply(7) which is installed to perform electroplating, and in which the anode is connected to the plating solution inside the cylinder, and the cathode is connected to a metal alloy or pure metal to be plated.
申请公布号 KR20030083905(A) 申请公布日期 2003.11.01
申请号 KR20020022302 申请日期 2002.04.23
申请人 STD CO., LTD. 发明人 JUNG, OK MIN
分类号 C25D5/02;(IPC1-7):C25D5/02 主分类号 C25D5/02
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