METHOD FOR ASSEMBLING SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A method for assembling a semiconductor chip package is provided to control a time loss and a economical loss by re-disposing the order of processes and by eliminating an unnecessary process. CONSTITUTION: A ring and tape are attached to a wafer(1). The wafer is sawed to individual semiconductor chips(2). The wafer information given to the wafer is recognized by a wafer information recognizing unit(3). The individual semiconductor chips are transferred and attached to each semiconductor chip attach position based upon the recognized wafer information(4).