PRE-MOLD TYPE SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREFOR

摘要

PURPOSE: A pre-mold type semiconductor package and a fabricating method therefor are provided to control damage to a leadframe and improve a heat radiation effect by forming a partial epoxy molding compound(EMC) unit on the lower surface of a pre-molded EMC such that the partial EMC unit is capable of supporting pushing force of an upper mold. CONSTITUTION: The leadframe includes a chip pad(108), an inner lead(104), an outer lead and a tie bar. The pre-molded type EMC encapsulates the leadframe. The first window that exposes a part of the chip pad and the inner lead is formed on the upper surface of the pre-mold type EMC and a cavity is formed in the outside of the upper direction of the first window. The second window that partially exposes the chip pad and the inner lead is formed on the lower surface of the pre-mold type EMC. A chip(112) is attached to the chip pad on the exposed leadframe by using adhesive(114). The chip is connected to the inner lead of the leadframe with a wire(110). A coating film(116) covers the chip and the wire in the first window of the pre-mold type EMC. A cap(118) seals the coating film and the cavity, inserted into the cavity on the upper surface of the pre-mold type EMC.