| 摘要 |
PROBLEM TO BE SOLVED: To enhance a yield when a bump is formed and to surely eliminate a mounting error of a solder ball and a defective bump. SOLUTION: Solder balls 4 are mounted collectively on respective bump formation positions 2 on a work 1 so as to be inspected, a repair process in which the solder balls 4 are remounted on the positions 2 having the mounting error is performed, the solder balls 4 mounted on the positions 2 are melted so as to be cooled and solidified, and bumps are formed. In the repair process for remounting the solder balls 4, the solder balls 4 are mounted newly on the positions 2 having the mounting error, and the solder balls 4 mounted newly on the positions 2 are irradiated with a laser beam so as to be melted and temporarily fixed. COPYRIGHT: (C)2004,JPO
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