| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the abrasion resistance of a tightening implement by which a capillary for a bonding apparatus used to connect an electrode of a semiconductor element to a lead electrode of a package is fixed to an ultrasonic vibration transmission horn, and to increase particularly the abrasion resistance of a part coming into contact with the capillary. <P>SOLUTION: A lower layer composed of a cemented carbide and an upper layer composed of a diamond sintered compact are laminated in parts in which tightening implement mainframes 14a, 14b come into contact with the capillary 10, the tightening implement is restrained from being worn away due to ultrasonic vibration during its use even in a part always coming into contact with the capillary, its proper surface roughness is maintained over a long period, and a life of the tightening implement is enhanced. Since the capillary is fixed firmly over a long period, the number of times of bonding operations and the accuracy of the bonding operation are enhanced. <P>COPYRIGHT: (C)2004,JPO |
