发明名称 COMPOSITE MODULE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a composite module in which an inductor and a capacitor are formed on the same substrate and which can be used for a high-frequency module such as the power amplifier, etc., and to provide a method of manufacturing the module. SOLUTION: In this composite module, the capacitor and the inductor are provided at different positions on the surface of the semiconductor substrate, and at the same time, a magnetic film is formed between the substrate and the inductor. In addition, a first interlayer insulating film having a thickness that makes the distance between the semiconductor substrate and magnetic film optimum is formed between the substrate and the magnetic film, and a second interlayer insulating film having a thickness that makes the distance between the magnetic film and inductor appropriate is formed between the magnetic film and the inductor. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003309185(A) 申请公布日期 2003.10.31
申请号 JP20020116488 申请日期 2002.04.18
申请人 TAIYO YUDEN CO LTD 发明人 OTA KENICHI;FUJIMOTO MASAYUKI
分类号 H01L21/822;H01L27/04;(IPC1-7):H01L21/822 主分类号 H01L21/822
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