| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing method with which bond strength is improved without reducing electroconductivity when adhesion is carried out by using a silicone resin-based electroconductive adhesive. SOLUTION: The method for curing the silicone resin-based electroconductive adhesive comprises a curing method in which a temporary curing process to be carried out in the temperature range of 140-160°C, a cooling to be carried out in the temperature range at least 50-70°C lower than that of the temporary cooling process and a main curing process to be carried out in the temperature range at least 80°C higher than that of the temporary curing process are successively performed. COPYRIGHT: (C)2004,JPO
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