| 摘要 |
PROBLEM TO BE SOLVED: To provide plating equipment by which more uniform plating treatment can be applied to the whole of a surface to be plated of a wafer and moreover plating treatment can be uniformly applied to the surface to be treated of a larger area with certainty. SOLUTION: The wafer plating equipment has a stirring rod 41 in a plating tank 10, and plating treatment is applied to the surface to be treated of the wafer W while agitating a plating solution in the vicinity of the surface to be treated by moving the stirring rod 41. In this wafer plating equipment, the stirring rod 41 is rotated while being shaken within a motion plane practically parallel to the surface to be plated of the wafer W. By this operation, the generation of the eddy flow of the plating solution can be suppressed during agitation and more uniform plating treatment can be applied to a wider range with certainty. COPYRIGHT: (C)2004,JPO
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