| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional pattern having adhesiveness, retaining adhesiveness after pattern formation, capable of adhering to another substrate in a final curing process by irradiation with a high energy beam or by heating, and giving a finally cured pattern exhibiting very high heat-, water- and solvent resistances and very high dimensional stability. SOLUTION: The three-dimensional pattern consists of a half cured photosensitive resin composition containing (A) a compound having a ring-opening polymerizable reactive group in its molecule and (C) a compound which absorbs a high energy beam and generates an acid or a base as essential components. The minimum size of the pattern is ≤50 μm, the height is 1 μm to 1 mm and the surface tack of the pattern is ≥98 N/m. COPYRIGHT: (C)2004,JPO
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