| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist applying apparatus and a resist applying method for preventing the resist that is forced out of a semiconductor substrate from adhering onto the side of a reinforcing plate, when applying the resist while the semiconductor substrate is put to the reinforcing plate. SOLUTION: The resist applying apparatus 101 has electromagnets 103a and 103b at the outer periphery section of a chuck section 102 for enabling a sapphire plate 3 where a GaAs substrate 2 is subjected to vacuum suction, and covers the surface of the sapphire plate 3 that is exposed from the GaAs substrate 2 with masks 106 made of a magnetic material for coating the resist. COPYRIGHT: (C)2004,JPO
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