| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a rational manufacturing method of a wiring base board for accommodating an IC chip in a base board body. <P>SOLUTION: The wiring base board 101 is provided with a core base board 103 having a receiving part 111 and an IC chip IC2 accommodated in the receiving part 111. This manufacturing method comprises a process for blocking an opening 111b on the side of the receiving part 111 by a sheet member 153 having an adhesive 151 on the surface thereof to expose the adhesive 151 to the inside of the receiving part 111, a process for arranging the IC chip IC2 in the receiving part 111 so that the IC chip IC2 is brought into a condition that the same is adhered to the sheet member 153, and a process for fixing the IC chip IC2 in the core base board 103 by filling a fixing resin 113 into the receiving part 111 and curing the same. <P>COPYRIGHT: (C)2004,JPO |
