| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for liquid treatment capable of suppressing the occurrence of a water mark. SOLUTION: A rinsing apparatus 1 comprises a spin chuck 59 which holds a wafer W, an underplate 63 capable of facing the rear surface of the wafer W with a prescribed space, and a shaft 67 which supports the underplate 63. A rear-side rinsing nozzle 75 penetrating the underplate 63 and the shaft 67 is supplied with a liquid chemical, pure water, and gas through open/close valves 102a, 102b, and 102d, respectively. The liquid chemical and pure water remaining in the rear surface rinsing nozzle 75 are sucked by a sucking apparatus 130a through the open/close valve 102c. After the wafer W is treated with the pure water, the pure water remaining in the rear surface rinsing nozzle 75 is sucked and removed by the sucking apparatus 103a. Then the gas is blown against the rear surface of the wafer W to suppress the occurrence of a water mark on the rear surface of the wafer W. COPYRIGHT: (C)2004,JPO
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