LEAD FRAME MEMBER AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE EMPLOYING THE LEAD FRAME MEMBER AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor package which does not need a rear-surface tape conventionally required to fix a lead, and prevent the flow of sealing resin upon sealing the resin in the manufacturing process of an batch mold type semiconductor package, and which comprises a process capable of solving conventional problems.

SOLUTION: A lead frame member for the batch mold type semiconductor package, which is employed for manufacturing the non-lead type thin semiconductor package by the manufacturing method of the batch mold type semiconductor package, is provided with a frame wherein a plurality of rows of lead frames are arrayed, and insulating resin for fixing the lead frame and preventing the flow of sealing resin upon resin sealing is filled into a gap between front and rear surfaces of respective lead frames of the frame.

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