| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a circuit board tape, without the use of expensive facility, such as vacuum furnace or the like. SOLUTION: The method of manufacturing a circuit board tape comprises a coating process 101 to coat a metal organic substance to the single surface or both surfaces of an insulation base film, a vaporizing/drying process 102 to vaporize and dry the metal organic substance coated in the coating process, a burning process 103 to form a conductor metal layer for the plating by burning the metal organic substance vaporized and dried up in the vaporizing/drying process, a plating process 104 to electrically plate a main conductor metal layer on the conductor metal layer for the plating formed in the burning process, and a smoothing process 105 to smooth a plated metal which is crystal-separated in the plating process. COPYRIGHT: (C)2004,JPO
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